Advaith Engineering

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PCB DESIGN SERVICES

Printed circuit boards (PCBs) are the heart of modern electronic devices. Critical expertise is needed to address the increasing complexity of modern electronic systems.

We are well equipped with modern cutting-edge technologies of layout designing and signal integration using EDA tools. Our complex high-density boards capabilities include more than 20 layers using advanced PCB design technologies such as microvias, high-density interconnects (HDIs) and high-ball-count FPGAs.

Our PCB team is well trained and experienced in designing high density rugged digital, analog and power supply boards using MIL quality standards.

We do Signal Integrity analysis, Differential Signals – length matching, High Speed signals – Signal Integrity Analysis, Clock Routing - Signal Integrity Analysis, Planar Transformer design, Power Supply – High Current Planes and Vias, Thermal Plane for uniform Heat transfer in the layout designing and signal integration.

We offer Signal Integrity Analysis, Differential Signals - Length Matching, High Speed Signals - Signal Integrity Analysis, Clock Routing - Signal Integrity Analysis, Planar Transformer Design, Power Supply - High Current Planes and Routes, Thermal Plane for Heat Transfer.

MANUFACTURING SERVICES

We are equipped for Defense & aerospace grade assembly andWe provide build-to-print manufacturing services for high reliability printed circuit board assemblies using state-of-the-art solder paste printing machine, automated pick and place equipment

We also design board stencils wherever required. Manufacturing facilities include production of cables, integration of box solutions and integration of large rack systems. Our in-house processes are governed by strict internal and international standards, worthy of repeatability and consistency.

All printed circuit board assemblies are tested for 100% functionality using specialized test equipment / test jigs. The modules are subjected to Environmental Stress Screening (ESS) to remove any latent defects. This ensures lower field failures and hence warranty cost for our customers.

Our products can conform to a wide range of quality standards including:

IPC J-STD-001: Requirements for soldered electrical and electronic assemblies

IPC A- 610: Acceptability standards for electronic assemblies.

IPC 7711 / 7721: Rework of electronic assemblies and Repair and modification of printed boards and electronic assemblies

IPC A 620: Requirements and acceptance for cable and wire harness assemblies.

ESD: ANSI / ESD S 20.20 :2007

MIL-STD-810: Environmental test methods

JSS 55555: Environmental test methods

FUNCTIONAL TESTING
ENVIRONMENTAL TESTING
THERMAL CYCLING
RANDOM VIBRATION/ BUMP TESTING
EMI /EMC

Functional testing is performed to avoid assembly problems including shorts, openings, missing components (or) installation of incorrect parts.

We are equipped with customized testing strategies that ensure our product is fully functional before being delivered to our clients and customers. Our engineers are mastered with the art of functional testing to cosmically acceptable standards.

PCB DESIGN SERVICES

Printed circuit boards (PCBs) are the heart of modern electronic devices. Critical expertise is needed to address the increasing complexity of modern electronic systems.

Our PCB team is well trained and experienced in designing high density rugged digital, analog and power supply boards using MIL quality standards.

We offer Signal Integrity Analysis, Differential Signals - Length Matching, High Speed Signals - Signal Integrity Analysis, Clock Routing - Signal Integrity Analysis, Planar Transformer Design, Power Supply - High Current Planes and Routes, Thermal Plane for Heat Transfer.

MANUFACTURING SERVICES

We are equipped for Defense & aerospace grade assembly andWe provide build-to-print manufacturing services for high reliability printed circuit board assemblies using state-of-the-art solder paste printing machine, automated pick and place equipment

We also design board stencils wherever required. Manufacturing facilities include production of cables, integration of box solutions and integration of large rack systems. Our in-house processes are governed by strict internal and international standards, worthy of repeatability and consistency.

All printed circuit board assemblies are tested for 100% functionality using specialized test equipment / test jigs. The modules are subjected to Environmental Stress Screening (ESS) to remove any latent defects. This ensures lower field failures and hence warranty cost for our customers.

Our products can conform to a wide range of quality standards including:

IPC J-STD-001: Requirements for soldered electrical and electronic assemblies

IPC A- 610: Acceptability standards for electronic assemblies.

IPC 7711 / 7721: Rework of electronic assemblies and Repair and modification of printed boards and electronic assemblies

IPC A 620: Requirements and acceptance for cable and wire harness assemblies.

ESD: ANSI / ESD S 20.20 :2007

MIL-STD-810: Environmental test methods

JSS 55555: Environmental test methods

Functional testing is performed to avoid assembly problems including shorts, openings, missing components (or) installation of incorrect parts.

We are equipped with customized testing strategies that ensure our product is fully functional before being delivered to our clients and customers. Our engineers are mastered with the art of functional testing to cosmically acceptable standards.

Environmental testing covers full gamut of vibration, operating temp, temperature cycling, HASS (highly accelerated stress screening), shock, thermal shock, humidity, etc, as per customer requirements. This testing facilitates the validation and meeting of production requirements

The purpose of this test is to determine the ability of the product to withstand the effects (material fatigue, temperature stresses etc…) of fast changes of temperatures from 85°C to -40°C

This test put a strain on product so that the subsequent effect of different coefficients of thermal expansion of parts of the product is show up hidden defects like poor soldering, cracked cells, delamination, performance reduction and inuslation resistance etc.).

ESS was developed to help manufacturers detect product defects and manufacturing defects. Screening can force infancy board and component failures that may occur after final assembly and product delivery

It aims to eliminate all types of defects, avoid material damageand increase reliability. ESS improves product quality, product reliability, production efficiency and profit margins. It reduces field defects, time to market and failures in the field.

The objectives or applications of random vibration testing in industry are generally to assess device durability and to verify whether a device will perform or fail under the extreme conditions to which it is exposed during its life cycle.

Random vibration testing is usually the main testing technique for this type of application, as all frequencies are emitted simultaneously, therefore creating a more realistic representation of what is happening in the "real world".

EMI/EMC is a serious challenge for electronics manufacturers today. It is said to affect the efficiency of electronic devices. We offer a full range of certification to meet the testing needs and provide verification service with the help of integrated EMI/EMC laboratory.